HP ist der Markenname für GC-Säulen von Agilent Technologies™. Die Säulen decken einen sehr weiten Polaritäts- und Anwendungsbereich ab und sind sehr inert. Alle HP-Phasen außer HP-88, HP-101 und HP-17 sind gebunden und quervernetzt, sowie mit Lösungsmitteln spülbar.
HP-1:
HP-1ms:
HP-5:
HP-5ms:
HP-35:
HP-50+:
HP-INNOWax:
HP-FFAP:
HP-PONA:
HP-1 mit Aluminium überzogen:
HP-PAS5:
HP-5ms Semivolatile:
HP-VOC:
HP-88:
HP-Chiral β:
HP-Blood Alcohol:
HP-Fast Residual Solvent:
HP-PLOT Q:
HP-PLOT U
HP-PLOT Al2O3 KCl:
HP-PLOT Al2O3 S:
HP-PLOT Al2O3 M:
HP-PLOT-Molesieve:
HP-101:
HP-17:
Säulen-Name | Phase | Polarität | USP | Durchmesser | Filmdicke | Tmax[1] |
HP-1 | Dimethyl polysiloxane (100%) | Non-Polar | G1, | 0.18 mm | 0.18 µm | 325‒350 °C |
0.20 mm | 0.11, 0.33, 0.50 µm | |||||
0.25 mm | 0.10, 0.25, 0.50, 1.0 µm | |||||
HP-1ms | Dimethyl polysiloxane (100%) | Non-Polar | G1, | 0.18 mm | 0.18 µm | 325‒350 °C |
0.20 mm | 0.33 µm | |||||
0.25 mm | 0.10, 0.25, 0.50, 1.0 µm | |||||
0.32 mm | 0.25, 0.52, 1.0 µm | |||||
HP-5 | Diphenyl-/dimethylpolysiloxane (5%/95%) | Non-Polar | G27 | 0.18 mm | 0.18 µm | 325‒350 °C |
0.20 mm | 0.11, 0.33, 0.50 µm | |||||
0.25 mm | 0.10, 0.25, 1.0 µm | |||||
HP-5ms | Diphenyl-/dimethylpolysiloxane (5%/95%) | Non-Polar | G27 | 0.18 mm | 0.18 µm | 325‒350 °C |
0.20 mm | 0.33 µm | |||||
0.25 mm | 0.10, 0.25, 0.50, 1.0 µm | |||||
0.32 mm | 0.10, 0.25, 0.50, 0.52, 1.0 µm | |||||
HP-35 | Diphenyl-/dimethylpolysiloxane (35%/65%) | Mid-Polar | G42 | 0.25 mm | 0.25 µm | 300‒320 °C |
0.32 mm | 0.25, 0.50 µm | |||||
HP-50+ | Diphenyl-/dimethylpolysiloxane (50%/50%) | Mid-Polar | G3 | 0.18 mm | 0.18 µm | 260‒300 °C |
0.20 mm | 0.31 µm | |||||
0.25 mm | 0.15, 0.25, 0.50 µm | |||||
0.32 mm | 0.25, 0.50 µm | |||||
0.53 mm | 0.50, 1.0 µm | |||||
HP-INNOWax | Polyethylene Glycol (PEG) | Polar | G16 | 0.18 mm | 0.18 µm | 240‒270 °C |
0.20 mm | 0.20, 0.40 µm | |||||
0.25 mm | 0.10, 0.15, 0.25, 0.50 µm | |||||
0.32 mm | 0.15, 0.25, 0.50 µm | |||||
0.53 mm | 1.0 µm | |||||
HP-FFAP | PEG (Nitroterephthalic acid modified) | Polar | G35 | 0.20 mm | 0.33 µm | 240‒250 °C |
0.25 mm | 0.25 µm | |||||
0.32 mm | 0.25, 0.50 µm | |||||
0.53 mm | 1.0 µm | |||||
HP-PONA | Dimethyl polysiloxane (100%) | Non-Polar | N/A | 0.20 mm | 0.50 µm | 325‒350 °C |
HP-1 Aluminium Clad | Dimethyl polysiloxane (100%) | Non-Polar | N/A | 0.53 mm | 0.09 µm | 350‒450 °C |
HP-PAS5 | N/A | Non-Polar | N/A | 0.32 mm | 0.52 µm | 325‒350 °C |
HP-5ms Semivolatile | Diphenyl-/dimethylpolysiloxane (5%/95%) | Non-Polar | G27 | 0.25 µm | 0.50 µm | 325‒350 °C |
HP-VOC | N/A | Low-Polar | N/A | 0.20 mm | 1.1 µm | 280‒290 °C |
0.32 mm | 1.8 µm | |||||
0.53 mm | 3.0 µm | |||||
HP-88 | (88%-Cyanopropyl)-aryl-polysiloxan | Polar | N/A | 0.25 mm | 0.20 µm | 250‒260 °C |
HP-Chiral β | β-Cyclodextrin in (35%-Phenyl)-methylpolysiloxane | N/A | N/A | 0.25 mm | 0.25 µm | 240‒250 °C |
0.32 mm | 0.25 µm | |||||
HP-Fast Residual Solvent | N/A | N/A | G43 | 0.53 mm | 1.0 µm | 260 °C |
HP-PLOT Q | Styrene-Divinylbenzene-Copolymer | Non-Polar | N/A | 0.32 mm | 20.0 µm | 270‒290 °C |
0.53 mm | 40.0 µm | |||||
HP-PLOT U | Divinylbenzene/Ethylenglycol-Dimethacrylate | N/A | G45 | 0.32 mm | 10.0 µm | 190 °C |
0.53 mm | 20.0 µm | |||||
HP-PLOT Al2O3 KCl | Aluminium oxide deactivated with KCl | Low-Polar | N/A | 0.25 mm | 5.0 µm | 200 °C |
0.32 mm | 8.0 µm | |||||
0.53 mm | 15.0 µm | |||||
HP-PLOT Al2O3 S | Aluminium oxide deactivated with sodium sulfate | Mid-Polar | N/A | 0.25 mm | 5.0 µm | 200 °C |
0.32 mm | 8.0 µm | |||||
0.53 mm | 15.0 µm | |||||
HP-PLOT Al2O3 M | Aluminium oxide deactivated with proprietary deactivation | Polar | N/A | 0.32 mm | 8.0 µm | 200 °C |
0.53 mm | 15.0 µm | |||||
HP-PLOT-Molesieve | 5Å Molesieve | N/A | N/A | 0.32 mm | 12.0, 25.0 µm | 300 °C |
0.53 mm | 25.0, 50.0 µm | |||||
HP-101 | Dimethyl polysiloxane (100%) | Non-Polar | N/A | 0.20 mm | 0.20, 0.25 µm | 280 °C |
0.32 mm | 0.30 µm | |||||
HP-17 | Diphenyl-/dimethylpolysiloxane (50%/50%) | Mid-Polar | N/A | 0.53 mm | 2.0 µm | 260‒280 °C |
[1] Abhängig von der Filmdicke und ob bei konstanter Temperatur oder mit einem Gradienten gearbeitet wird